PLAINVIEW, N.Y. — December 1, 2025 — Leads & Copy —
Veeco Instruments Inc. (NASDAQ: VECO) announced that a leading semiconductor memory company has chosen Veeco’s laser spike annealing (LSA system) for evaluation in its advanced DRAM R&D group. The evaluation period is expected to take about one year, with follow-on orders anticipated in 2027 and beyond.
The shipment signifies Veeco’s increasing presence in the DRAM market and marks a step toward HVM adoption for next-generation DRAM and high bandwidth memory (HBM) technologies.
According to Adrian Devasahayam, Ph.D., Veeco’s Senior Vice President, Product Line Management, the LSA platform is engineered to meet the rigorous demands of advanced DRAM and HBM production by providing higher productivity and superior performance. Devasahayam stated that the evaluation shipment underscores Veeco’s commitment to enabling cutting-edge memory technologies, while providing an opportunity to expand its footprint in the memory market with this major customer.
Veeco’s LSA system is capable of high-temperature annealing while staying within reduced thermal budgets of advanced devices at leading-edge nodes. The system delivers market-leading performance and cost of ownership, making it a solution for advanced memory applications.
LSA is a millisecond annealing technology used in front-end semiconductor manufacturing to lower the resistance of key transistor structures by activating dopants. As the demand for HBM and DRAM continues to rise, driven by AI workloads and next-generation computing, Veeco’s LSA technology is positioned to support the evolving needs of tier 1 semiconductor manufacturers.
Yole market research estimates that the HBM market will grow at a compound annual growth rate (CAGR) of nearly 30% through 2030, reaching $100B or more in annualized revenues.
Veeco Contacts:
Investor Relations: Alex Delacroix | (516) 528-1020 | adelacroix@veeco.com
Media: Brenden Wright | (410) 984-2610 | bwright@veeco.com
Source: Veeco
