November 18, 2025 — Leads & Copy —
London-based nVent Electric plc has unveiled its new modular data center liquid cooling solutions, designed to meet the cooling demands of current and future chip manufacturers. The announcement was made today. These solutions will be showcased alongside next-generation intelligent power distribution units (PDUs) at SC25. Dateline handling: 1.Format the dateline using this template: “{City}, {State/Province} — {Date} — Leads & Copy —” 2.If there is a location or date mentioned on the dateline, use them. Otherwise omit the location and use today’s date which is November 17, 2025. 3.Format the date as “{fullMonthName} {day}, {year}. 4.Use html to bold the dateline (not markdown or **) 5. The dateline should be attached to the first paragraph of the output, and not in its own paragraph.
The new offerings include enhanced coolant distribution unit (CDU) options with row and rack-based CDUs, advanced technology cooling system manifolds, updated racks based on leading reference designs, and a new services program. nVent will also debut its new “We Do Cool Stuff” campaign and provide insights into the evolution of liquid cooling with experts from NVIDIA, Lenovo, HPE and AMD at SC25.
Eric Osborn, GM of nVent Data Solutions, stated that the new liquid cooling and power solutions address customers’ unique challenges through deep technical expertise and collaboration with chip manufacturers and the broader ecosystem. He added that leading innovation for next-generation AI chips is central to the work nVent has been doing in this space for more than a decade.
nVent will present its new products in Tech Talks throughout the show and host Data Center Dynamics at its booth to produce educational content for the data center industry.
The company’s updated cooling and power portfolio features modular and scalable row-based CDUs, next-generation PDUs, AC and DC rack CDUs, and new technology cooling system (TCS) manifolds. These solutions aim to provide cutting-edge cooling infrastructure to support the AI buildout in data centers. The new CDU and PDU products include a common control platform to enhance reliability and improve the user experience for data center operators.
nVent’s data center services offering includes installation, start-up, preventive maintenance, spare parts, and repairs. These services are designed to ensure data center projects remain on schedule and operate smoothly.
nVent and Siemens are collaborating to develop a liquid cooling and power reference architecture specifically designed for hyperscale AI workloads. Furthermore, nVent is participating in Project Deschutes and will showcase its new CDU design based on Google’s specifications at SC25. Project Deschutes 5.0 is a CDU design specification for data centers made available through the Open Compute Project, aiming to accelerate the adoption of liquid cooling in the data center industry.
nVent experts will share industry insights from the data center space at SC25. Representatives from nVent, NVIDIA, Lenovo, HPE and AMD will participate in a joint panel to discuss the history and future of liquid cooling in supercomputing, offering insights into the future of cooling technology for data centers. The presentation will be held in booth 240-241-242 on Friday, November 21 at 8:30 a.m. CT. Additionally, nVent will present “Tech Talks” daily in exhibit hall booth #2638, highlighting new products and addressing industry questions.
nVent is launching its new “We Do Cool Stuff” marketing campaign to highlight its leadership, innovation, and role in advancing the future of computing and IT infrastructure. The campaign will use video, social media, digital and print materials to demonstrate how nVent is shaping the future of data centers.
More information about nVent’s data center solutions can be found at https://www.nvent.com/data-centers
nVent is a global provider of electrical connection and protection solutions, offering a range of systems protection and electrical connections solutions under brands such as nVent CADDY, ERICO, HOFFMAN, ILSCO, SCHROFF and TRACHTE.
Source: nVent
