BOISE, Idaho — October 22, 2025 — Leads & Copy — Micron Technology, Inc. (Nasdaq: MU) has begun sampling its 192GB SOCAMM2 modules, aimed at enhancing low-power memory adoption in AI data centers. The new modules extend the capabilities of Micron’s LPDRAM SOCAMM, offering 50% more capacity within the same compact size.
The 192GB SOCAMM2, utilizing Micron’s 1-gamma DRAM process, improves power efficiency by over 20% and can reduce time to first token (TTFT) by more than 80% in real-time inference workloads. Its modular design enhances serviceability and supports future capacity expansion.
Micron’s SOCAMM2 delivers LPDDR5X’s low power consumption and high bandwidth to AI systems’ main memory, meeting the demands of massive-context AI platforms. The design improves power efficiency by more than two-thirds compared with equivalent RDIMMs, while occupying a third of the size.
SOCAMM2 customer samples are currently shipping in capacities up to 192GB per module and speeds up to 9.6 Gbps, with high-volume production scheduled alongside customer launches.
Mengxi Liu Evensen
+1 (408) 444-2276
productandtechnology@micron.com
Satya Kumar
+1 (408) 450-6199
satyakumar@micron.com
Source: Micron Technology, Inc.
