SANTA CLARA, Calif. — October 7, 2025 — Leads & Copy —Applied Materials, Inc. has introduced new semiconductor manufacturing systems designed to enhance the performance of advanced logic and memory chips, which are crucial for AI computing.
The new products target key areas in the development of AI chips, including leading-edge logic with Gate-All-Around (GAA) transistors, high-performance DRAM with high-bandwidth memory (HBM), and advanced packaging for integrated systems-in-a-package.
According to Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials, the company is focused on materials engineering breakthroughs to improve the performance and power-efficiency needed to scale AI.
The Kinex™ Bonding system, developed with BE Semiconductor Industries N.V. (Besi), integrates die-to-wafer hybrid bonding to improve performance and reduce power consumption in GPUs and high-performance computing chips.
The Centura™ Xtera™ Epi system enables higher performance GAA transistors at 2nm and beyond by depositing void-free, uniform epitaxial layers.
The PROVision™ 10 eBeam metrology system enhances the yield of complex 3D chips by providing sub-nanometer resolution, fast throughput, and deep imaging.
Keith Wells, Group Vice President of Imaging and Process Control at Applied Materials, notes that the increased use of 3D architectures in logic and memory is creating new metrology challenges.
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Investor Relations (Financial Community) 408.986.7977
Source: Applied Materials
