January 29, 2026 — Leads & Copy — Teradyne, Inc. and MultiLane have announced an agreement to form a joint venture, MultiLane Test Products (MLTP), to meet the growing demand from the AI Data Center equipment market. The transaction is expected to close in the first half of 2026, pending customary closing conditions.
According to the press release, MultiLane will contribute all assets related to its test and measurement business to the joint venture. However it will maintain its interconnects and data center test solutions business. Teradyne will be the majority owner, with MultiLane retaining minority ownership. The joint venture is intended to leverage Teradyne’s reach in the global electronics test market and MultiLane’s expertise in high-speed instrumentation.
Greg Smith, President and CEO of Teradyne, stated the creation of MultiLane Test Products expands the company’s ability to support customers from the wafer level to the data center. He also said that MultiLane’s innovation in high-speed test is expected to expand the served market for Teradyne’s Semiconductor Test and Product Test Groups.
Fadi Daou, Founder and CEO of MultiLane, said that the company was founded on the concept that high-speed connectivity is the backbone of computing. According to Daou, the joint venture will create a global platform that combines MultiLane’s technical leadership with Teradyne’s commercial scale and customer reach.
Teradyne designs, develops, and manufactures automated test equipment and advanced robotics systems. MultiLane is a global leader in high-speed I/O and data center Interconnect test solutions.
This joint venture is expected to accelerate innovation and expand access to test solutions for the AI and data center markets.
Teradyne® and MultiLane® are registered trademarks of Teradyne, Inc. and HTP SAL respectively.
Source: Teradyne
