ZÜRICH, CH — October 6, 2025 — Leads & Copy — Enclustra, a Swiss-based leader in FPGA innovation, has launched its new Physical AI Technology Line in partnership with SiMa.ai. This follows their March 2025 announcement at Embedded World, Nuremberg, introducing the MLSoC™ Modalix System-on-Module (SoM), which uses SiMa.ai’s 50 TOPS MLSoC device.
The Modalix SoM offers a high-performance, energy-efficient solution for multi-modal AI, Physical AI, and Generative AI applications. It targets industries such as manufacturing, robotics, industrial automation, aerospace, and defense, enabling faster and more reliable integration of advanced AI capabilities.
Key benefits of the Modalix MLSoM include best-in-class processing with 50 TOPS of edge-optimized computing power, seamless integration and flexibility with a compact design and extensive I/O options, accelerated AI development via SiMa.ai’s ONE Platform for Physical AI, and industrial-grade reliability with advanced thermal management and performance monitoring.
According to Philipp Baechtold, CEO of Enclustra, this launch strengthens their ability to deliver Edge AI solutions. Krishna Rangasayee, CEO and Founder of SiMa.ai, noted that the Modalix SoM represents a critical expansion into Physical AI.
Engineering samples of the MLSoC Modalix SoM are now available through Enclustra’s Early Access Program. Interested organizations can request participation at www.enclustra.com.
Monica Sanchez Meza, Head of Global Marketing & Communications at Enclustra, can be reached at monica.sanchezmeza@enclustra.com or +4143 343 3943.
Source: Enclustra
